preliminary SIPC06N60C2 edited by infineon technologies ai ip dd hv2, l 5423p , edition 1, 09.10.00 11:15 fast coolmos tm power transistor applications: smps, resonant applications features: new revolutionary high voltage technology ultra low gate charge worlbest r ds(on) per chip area ultra low effective capacitances improved noise immunity chip type v ds i d die size package ordering code SIPC06N60C2 600v 4a 2.45 x 2.60 mm 2 sawn on foil tbd mechanical parameter: raster size 2.45 x 2.60 source pad size 1.64 x 2.02 gate pad size 0.47 x 0.53 mm area total / active 6.37 / 3.96 mm 2 thickness 175 m wafer size 150 mm flat position 0 grd max.possible chips per wafer 2388 passivation frontside photoimide emitter metallization 3200 nm al si 1% collector metallization 1400 nm ni ag ?system suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond ( proposed) source: al, 500m; gate: al, 125m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, in dry nitrogen, < 6 month
preliminary SIPC06N60C2 edited by infineon technologies ai ip dd hv2, l 5423p , edition 1, 09.10.00 11:15 maximum ratings : parameter symbol value unit drain-source voltage v ds 600 v dc drain current, limited by t jmax i d 4 a pulsed drain current, t p limited by t jmax i dpuls 8 a gate source voltage v gs 20 v operating junction and storage temperature t j , t stg -55 ... +150 c reverse diode dv/ dt i s =4a, v ds preliminary SIPC06N60C2 edited by infineon technologies ai ip dd hv2, l 5423p , edition 1, 09.10.00 11:15 chip drawing:
preliminary SIPC06N60C2 edited by infineon technologies ai ip dd hv2, l 5423p , edition 1, 09.10.00 11:15 further electrical characteristics: this chip data sheet refers to the device data sheet description: aql 0,65 for visual inspection according to failure catalog electrostatic discharge sensitive device according to mil-std 883 test- normen villach/ prffeld published by infineon technologies ag i gr ., bereich kommunikation st.-martin-strasse 53, d-81541 mnchen ? infineon technologies ag 1999 all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as warranted characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. infineon technologies is an approved cecc manufacturer. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office in germany or our infineon technologies representatives worldwide ( see address list). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/ or maintain and sustain and/ or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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